Applications

Cooling and Heating,
Temperature control for EV/HEV Automotive
 

EV/HEV Cooling and Heating

Currently, a major bottle-neck for EV development comes from battery and motor issues.

Besides that, the thermal management issues for each of the electric components is also of major importance. Fortunately, LEA's Al vapor chamber heat-sinks and Thermoelectric Vapor Chamber system offers excellent thermal solutions for the following.

Heat exchangers for inside of the vehicle:

  • High-power LED headlamp 

  • IGBT module for Inverter / converter

  • Junction boxes, battery packs

  • PCU (power control unit)...etc

  • For charging stations: Inverter

TVC Temperature Control System for EV/HEV Battery Management

Application:

The TVC is a battery temperature control system. Done by our specialized combination of the Peltier module and the aluminum vapor chamber.  


Cooling:

When the Peltier module is turned on, low temperatures are transferred via the vapor chamber in order to directly cool the battery cell.

 

Heating:

Changing the current of the Peltier module switches it to produce heat. Heat is then transferred via the vapor chamber, thus warming up the battery cell.

Features:

  • Easy to maintain module type system.

  • An integrated system that has both cooling and heating functions, along with high-cost performance

  • High uniformity temperature distribution

  • * Precise Temperature control. (<+/-2℃)

Lithium-ion battery heat dissipation vapor chamber

Features:

  • Large size aluminum vapor chamber

  • 8℃ Temperature difference within.

 

Application:
The world's first aluminum vapor chamber with a length of more than 1m. This VC is placed directly on the lithium-ion battery according to the width of the electric vehicle battery pack. Thus, it is used as a direct heat dissipating method.

Product No. :J0020201006-01
Dimensions :

1199 mm (L) x 182mm (W) x 10mm (T)
Weight:2.3kg

Semiconductor Devices, Communication Devices, IC Chips
 

Heat pipe-based heat sinks are an older but commonly used thermal device for semiconductors and IC chips. However, faced with high power output, the heat pipe heat sink becomes inefficient due to its limited heat transfer capabilities.

 

LEA's Al Vapor Chamber heat sink allows heat to be transported quicker due to the coolant within the chamber. The liquid reacts immediately with heat contact allowing more efficient heat transfer.

 

With the greater efficiency of heat transfer, the lighter weight of the cooling unit, and the reduced footprint of an Al vapor chamber heat sink, all this contributes to an overall greater efficiency to the heat-producing components in these devices.

For further info, please contact us. Click here!

Brazing heat exchanger for communication equipment

Specification

Product No. :J0030106002-01

Dimensions : 489.2mm (W) x 415.1mm (L) x 71mm (H)

Weight : 3,890 g

Features:​

  • Manufactured by integrated brazing with aluminum plates and fins.

  • Respective manufacturing results done with large brazing furnaces

Liquid-cold plate

Product No.:J0060108003-01

Weight : 2,150 g

Application :

Data Centers

For further info, please contact us. Click here!

Features :

  • Product of integrated brazing process using pre-existing aluminum materials

  • High flexibility in designing its internal liquid flow. Braze skive fins, pin fins, etc. to the location of the heat source within the internal structure.

  • Compared to conventional products of made by copper pipe and aluminum plate, the volume of this cold plate about 45% less with a reduced weight of approximately 60%.

Temperature Control for High-Power Cable Tunnels, High Power Voltage Cable (HPVC)

 

Temperature Monitoring and controlling system using LEA's Thermoelectric Vapor Chamber (TVC) system

The transition of overhead cables to underground tunnel cables has started to occur in multiple nations around the world.

 

​These power cables exert large amounts of heat while transporting energy, therefore creating a hot environment within the tunnels.

 

The common system in use to maintain the ambient temperature within these tunnels is the water-cooling chiller system. ​

Drawbacks of the Water-Cooling Chiller System
 

For this application, the water-cooling system has many flaws which LEA's TVC system can overcome.

Flaws of the Chiller system:

  • Risk of water leakage.

  • High installation and maintenance cost.

  • Requires large amounts of installation space for the compressor.

  • Multiple parts are necessary in order for the thermal system to function efficiently.

 

TVC Benefits:

  • TVC is a non-water system. (No water leakage risk), Safer option.

  • Low installation and maintenance cost while the installation space is flexible.

  • Easier for installation as it does not require multiple parts to work.

For further info, please contact us. Click here!

High-Power LED Lighting 
 

LED lighting represents a new generation of energy saving lighting. However, this new LED lighting also faces the same thermal challenges common to all other IC components.

 

It is understood that improved thermal management promotes higher component performance in terms of efficiency. Here at LEA, we provide solutions for various kinds of LED lighting with our custom-made heat sinks and vapor chambers to suit a variety of customer needs. 

For further info, please contact us. Click here!

Specifications:
No.: J0020106002-01
Dimensions: D 182 x H 190 mm
Weight: 2860 g
Compatible LED: 200 watt

Features:

 

  • Vapor chamber is produced through extrusion with its fins attached by a brazing process.  

  • Possesses a compact shape with reduced weight. Compared to conventional extruded heat sinks, its volume is 50% less while its weight is 65% lighter.

Click here for inquiries.

200W CoB High Power LED
High-Power IGBT Inverters
 

LEA's Heat sink & Vapor Chambers for High-Powered IGBTs

 

The current common solution for the thermal management of high-power IGBT modules is to use either larger extruded heat sinks, or to use water cycling cold plates. 

Flaws of these thermal solutions:

Extruded heat sinks have two major flaws for this application which are the inefficiency in heat exchange and its heavy weight. 

Al Vapor chamber Heat sink benefits

LEA's solutions include a non-water-based Al vapor chamber heat sink providing an efficient heat exchange solution while eliminating the risk of potential water leakage. Al vapor chambers are also naturally lighter in weight compared to conventional heat sinks.

For further info, please contact us. Click here!

For Industrial Use, IGBT ALVC heat sink.

Specifications:

No.:J0020103009-02

Dimensions: 165 (W) x 135 (L) x 78 (H) mm

Weight: 985 g

Compatible IGBT Power: 500 watt

Features:

  • A U-shaped vapor chamber is brazed with an aluminum base creating a uniform structure. 

  • The external fins are also brazed to the U-shaped vapor chamber.

  • Compact shape and lightweight. Able to perform as well as conventional heatsinks but with 50% volume reduction and a 60% weight reduction.

 
Medical Applications

Medical applications possess complex and unique thermal challenges compared to many other industries. The difficulty in this field is related to the fail-proof operation and functionality in ambient conditions. 

Our customizable solutions allow us to provide thermal control in complex environments that required precise temperature maintenance.

For further info, please contact us. Click here!

Aerospace, Military & Defense
 

With the advancement of global technology in the field of aerospace, military, and defense, complexity of these machines increases along with the need of better, new, and innovative solutions for its thermal problems. LEA's well-known value is the ability to provide innovative solutions to these new problems arising from the advancement of technology.

Most aerospace, military, and defense technologies require its thermal solutions to be able to cool high amount of heat exerted by their many components in drastically small and complex spaces. LEA's flexibility in a wide variety of fields give us the ability and experience to create solutions for these complex problems without having to forgo its high performance or succumb to expensive costs.

For further info, please contact us. Click here!

Leading Edge Associates Co., Ltd. 

5-23-2-103, Nishisuha-cho, Tachikawa-shi, Tokyo 190-0034, Japan

TEL:+81-42-520-8223