Vapor Chamber

The principle of Vapor Chamber technology

A vapor chamber is a vacuum receptacle with an inner capillary structure supported by the inside walls. The vapor chamber is filled to a set percentage of specified liquid.


When a heat source is attached to a vapor chamber, the working liquid at the heat source vaporizes instantly and the vapor rushes to fill the entire chamber.


This vapor will condense when it contacts the cooler sides of the wall; this initial vaporization of the liquid and consequent return to a liquid state, becomes a highly efficient heat exchange system.


The condensed liquid is then returned to the heat source via capillary action, ready to be vaporized again, repeating the cycle for as long as the heat source maintains a need for such heat exchange.


To construct the vapor chamber, three different types of technology is used.
1. Brazing technology

2. Vacuum technology

3. Charging technology

Aluminum Vapor Chamber Heatsink

With the functions of the vapor chamber combined with fins for its increased heat exchange surfaces, the heat exchange performance of the vapor chamber drastically increases.


Aluminum brazing technology is applied in order to combine the fins to the aluminum vapor chamber. The reason being is that brazing technology enables better thermal conductivity at the fin/vapor chamber joints, therefore the thermal performance is significantly higher compared to the usual extruded heat sink. Furthermore, Aluminum Vapor Chamber Heat-sinks has better flexibility in constructing shapes and has much lighter weight due to the empty spaces inside the vapor chamber.

Benefits of Al Vapor Chamber Heat-sink.

  • Light Weight, Durable.

  • Flexible and retains shape.

  • 30% faster as compared to water cooling transmission due to refrigerant.

  • Post machining is not required. Fins are welded together with the heatsink.

  • 100% aluminum, 100% recyclable

Thermoelectric Vapor Chamber System​

The TVC is a combination of vapor chamber technology with thermoelectric modules. The vapor chamber supports the thermoelectric modules by improving the its ability to cool the surroundings and maintain it at a stable temperature range.

Additionally, the vapor chamber enlarges the surface area of the thermoelectric modules for wider heating capacity.


Through this combination, a high coefficient of performance (COP) of 1.0~1.8 is achievable. Alongside, precise temperature control of (+/-0.5C) is also attainable through this unique combination.


The combination of these two thermal technologies enables LEA to achieve high performance in temperature control in a wide variety of applications.

Example Applications:

Li/Ion battery pack, EV

High Power Voltage Cable Tunnel.

Medical Transportation Cart/Box

Leading Edge Associates Co., Ltd. 

5-23-2-103, Nishisuha-cho, Tachikawa-shi, Tokyo 190-0034, Japan